Reflow soldering competition: detailed explanation and application of 8 types of soldering methods.

Reflow soldering technology has become one of the leading technologies in the electronic assembly industry since the 1980s. It improves production efficiency while ensuring product quality. As a main soldering method, reflow soldering can be divided into many types. This article will give you a detailed introduction to several main types of reflow soldering.

Hot Air Reflow Soldering

Hot air reflow soldering is a method that uses hot air to heat electronic components and pads. In this method, hot air is blown from the heated zone of the reflow oven through nozzles to make contact with the pads and component surfaces. The advantage of hot air reflow soldering is that it can evenly heat the entire soldering area, thereby reducing thermal stress and improving soldering quality.

Infrared reflow soldering

Infrared reflow is another common reflow method. It uses infrared light to heat electronic components and pads. Infrared rays have strong penetrating power and can penetrate deep into the material for heating. The advantage of this method is high thermal efficiency and fast heating speed. However, infrared heating can easily lead to local overheating, so it is necessary to control the energy and heating time of infrared radiation.
Vapor phase reflow

Vapor phase reflow is a method that uses steam for heating. In this method, the heat exchange fluid is heated to boiling in a heating zone, forming a layer of vapor. Electronic components and pads are heated by a layer of vapor. This heating method has the characteristics of high heat transfer efficiency and uniform heat distribution, which can reduce thermal stress and improve welding quality. But this method requires more complex equipment and higher operating skills.

Nitrogen reflow soldering

Nitrogen reflow soldering is a reflow soldering method performed under a nitrogen atmosphere. Nitrogen can effectively reduce oxidation and improve welding quality. In addition, nitrogen reflow can also improve the wettability of solder, thereby reducing solder joint defects. However, the disadvantage of this method is that the cost of nitrogen is relatively high, and special nitrogen reflow equipment is required.
Full heat reflow soldering

Full heat reflow soldering is a reflow soldering method that combines multiple heating methods such as hot air, infrared rays, and steam. This method can make full use of the advantages of various heating methods to improve welding quality and efficiency. Full heat reflow soldering requires more complex equipment and higher operating skills, but for some products with special requirements, full heat reflow soldering can bring better soldering results.

Laser reflow soldering

Laser reflow is a method that uses a laser to heat electronic components and pads. The laser has a high energy density and can rapidly heat the welding area in a short time. This method has the advantages of fast heating speed and precise positioning, and is especially suitable for welding high-density and miniaturized electronic components. However, the cost of laser reflow soldering equipment is relatively high, and requires high operating skills.

Optical Reflow Soldering

Photoreflow is a method of heating electronic components and pads using ultraviolet and visible light. This method has the advantages of uniform heating and little impact on the material. Optical reflow soldering is suitable for soldering high temperature sensitive components, but requires special optical reflow soldering equipment.
Ultrasonic reflow soldering

Ultrasonic reflow soldering is a method that uses ultrasonic waves to heat electronic components and pads. Ultrasonic heating has the advantages of high thermal efficiency and uniform heat distribution. This method is especially suitable for welding between metals, such as copper, aluminum, etc. However, ultrasonic reflow soldering requires high equipment and operating skills.