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How to control the reflow soldering process to ensure quality.


The quality of circuit board reflow soldering is affected by multiple processes, which must be controlled from each process. Guangshengde shares here how to control the reflow soldering process to ensure the quality of circuit board reflow soldering.
1. Solder paste storage: Solder paste should be stored in a cool and dry place, and the shelf life should not exceed the specified time. It should be stirred well before use and should be spread evenly on the pads of the PCB.

2. Solder paste application: The solder paste should be evenly applied on the pads of the PCB.

3. Accurate placement of components: Components should be placed accurately on the PCB to avoid misalignment or tilting.

3. Reflow oven temperature control: The temperature of the reflow oven should be strictly controlled to ensure that the solder paste melts and solidifies at the correct time and position.

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