SDN-8 Series Lead-Free Nitrogen Reflow Soldering
Product Overview:
Product Category:
- Description
- Parameter
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Feature of Product:
● Multi-layer thermal insulation furnace design, the surface temperature of the furnace shell is reduced by 10 to 20 degrees, effectively reducing the temperature of the working environment.
● 15% improvement in heat transfer efficiency to easily meet the lead-free process requirements of more complex and larger soldering products.
● Strengthen the main boom to ensure that the guide rail has no lateral deformation, and prevent the phenomenon of jamming and falling boards.
● A fully protected closed design is used in the furnace to effectively protect the nitrogen from loss, so that the oxygen content can reach 150ppm and the nitrogen consumption is low. In the environment of 300-800ppm oxygen concentration, only 95% of the materials on the machine can be used at 20-22m3/H recycle.
● The new cooling structure design makes most of the waste gas filtered or recovered and returned to the furnace, which reduces the loss of heat and makes the recovery of flux more thorough.
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CONTACT US
Tel:18915611993
Contact: Deng Xingxing
E-mail:dxx@starsea-sz.com
ADD: Building D, No.26, Yinhuan Road, Changshu National New & Hi-tech Industrial evelopment Zone